Technical Program

Thursday May 30th

10:00 AM - 12:00 PM

Session 39: Interactive Presentations 3
Committee:
Room: Aurora A-C Corridor

Session Co-Chairs:

Rao Bonda
Amkor
Email: [email protected]

Karan Bhangaonkar
Intel
Email: [email protected]

Amanpreet Kaur
Oakland University
Email: [email protected]

Jin Yang
Samsung
Email: [email protected]

Papers:

1. A Novel Detection Applied on Micro Defect in Bump Interface for 2.5DIC Package
Yi-Sheng Lin — Advanced Semiconductor Engineering, Inc.
Yu-Hsiang Hsiao — Advanced Semiconductor Engineering, Inc.
Cheng-Hsin Liu — Advanced Semiconductor Engineering, Inc.
Fan-Ju Hsiao — Advanced Semiconductor Engineering, Inc.

2. Hybrid Bonding Technology Chemical Mechanical Planarization Process Optimization Using Comprehensive 3D Modeling
Liu Jiang — Applied Materials, Inc.
El Mehdi Bazizi — Applied Materials, Inc.
Gregory Costrini — Applied Materials, Inc.
Prayudi Lianto — Applied Materials, Inc.
Gilbert See — Applied Materials, Inc.
Dimitrios Tsamados — Synopsys, Inc.
Yves Saad — Synopsys, Inc.
Sefa Dag — Applied Materials, Inc.

3. Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5D Heterogeneous Packages
Karthik Arun Deo — Binghamton University
Yangyang Lai — Binghamton University
Jong Hwan Ha — Binghamton University
Junbo Yang — Binghamton University
Seungbae Park — Binghamton University

4. Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV)
Junbo Yang — Binghamton University
Ke Pan — Binghamton University
Pengcheng Yin — Binghamton University
Yangyang Lai — Binghamton University
Seungbae Park — Binghamton University
Chukwudi Okoro — Corning, Inc.
Dhananjay Joshi — Corning Research and Development Corp.
Scott Pollard — Corning Research and Development Corp.

6. A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface
Chih-Jing Hsu — ASE Corporate R&D Center
Hsu-Nan Fang — ASE Corporate R&D Center
Tzu-Yu Su — ASE Corporate R&D Center
Zhao-Ze Jiang — ASE Corporate R&D Center
Yi-Hua Chen — ASE Corporate R&D Center
Chien-Ching Chen — ASE Corporate R&D Center
Yu-Bin Tsai — ASE Corporate R&D Center
Che-Ming Hsu — ASE Corporate R&D Center
Yuan-Feng Chiang — ASE Corporate R&D Center
Jen-Chieh Kao — ASE Corporate R&D Center
Yung-I Yeh — ASE Corporate R&D Center

7. Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects
Laura Wenzel — Fraunhofer IZM
Catharina Rudolph — Fraunhofer IZM
Adil Shehzad — Fraunhofer IZM
Partha Mukhopadhyay — Tokyo Electron America, Inc.
H. Jim Fulford — Tokyo Electron America, Inc.
Iuliana Panchenko — Fraunhofer IZM
Manuela Junghähnel — Fraunhofer IZM

8. Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration
Rohan Sahay — Georgia Institute of Technology
Shreyam Natani — University of California, San Diego
Dipayan Pal — University of California, San Diego
Victor Wang — University of California, San Diego
Chenghsuan Jimmy Kuo — University of California, San Diego
Ashita Victor — Georgia Institute of Technology
Muhannad Bakir — Georgia Institute of Technology
Andrew Kummel — University of California, San Diego

9. A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates
Ramon Sosa — Georgia Institute of Technology
Antonia Antoniou — Georgia Institute of Technology
Vanessa Smet — Georgia Institute of Technology

10. Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
Minhua Lu — IBM Research
Evan Colgan — IBM Research

12. Simulation of Bulge-Out Mechanism Enabling Sub-0.5 µm Scaling of Hybrid Wafer-to-Wafer Bonding
Jo De Messemaeker — imec
Koen Van Sever — imec
Yan Wen Tsau — imec
Boyao Zhang — imec
Kristof Croes — imec
Eric Beyne — imec

13. Wet Cu Passivation for High Throughput Fluxless Thermal Compression Bonding of Cu-Sn µbumps for Die-to-Wafer Stacking
Jens Rip — imec
Jaber Derakhshandeh — imec
Ryo Negishi — MEC Co., Ltd
Itsuro Tomatsu — MEC Co., Ltd
Dieter H. Cuypers — imec
Eric Beyne — imec

14. Low Temperature Nanocrystalline Cu/Polymer Hybrid Bonding With Tailored CMP Process
Lee Ou-Hsiang — Industrial Technology Research Institute
Chia-Hsin Lee — Brewer Science, Inc.
Hsiang-Hung Chang — Industrial Technology Research Institute
Wei-Lan Chiou — Industrial Technology Research Institute
Chia-Wen Chiang — Industrial Technology Research Institute
Andrew Tan — Brewer Science, Inc.
Shih-cheng Yu — Industrial Technology Research Institute
Ting-Yu Ke — Industrial Technology Research Institute
Yu-Min Lin — Industrial Technology Research Institute

15. A Novel FOPLP Structure With Chip First & RDL First Process for Automotive Chip Application
Terry Wang — Industrial Technology Research Institute
Chih Wei Lu — Industrial Technology Research Institute
Eric Feng — Industrial Technology Research Institute
Yu-Jhen Yang — Industrial Technology Research Institute
Cheng-Yueh Chang — Industrial Technology Research Institute
Pei-Pei Cheng — Industrial Technology Research Institute
Fredrick Lie — Applied Materials, Inc.
Austin Cheng — FAVITE, Inc.
Hsin-Yi Huang — Everlight Chemical Industrial Corp.
Meiten Koh — Taiyo Ink Mfg. Co., Ltd.
Aneta Wiatrowska — XTPL SA
Łukasz Witczak — XTPL SA

16. A Unified and Adaptive Continual Learning Method for Feature Segmentation of Buried Packages in 3D XRM Images
Richard Chang — Institute for Infocomm Research A*STAR
Jie Wang — Institute for Infocomm Research A*STAR
Namrata Thakur — Institute for Infocomm Research A*STAR
Ramanpreet Pahwa — Institute for Infocomm Research A*STAR
Yang Xulei — Institute for Infocomm Research A*STAR

17. Low Thermal Budget Fine-Pitch Cu/Dielectric Hybrid Bonding With Cu Microstructure Modifications
Hemanth Kumar Cheemalamarri — Institute of Microelectronics A*STAR
Anh Tran Van Nhat — Institute of Microelectronics A*STAR
Gim Guan Chen — Institute of Microelectronics A*STAR
Arvind Sundaram — Institute of Microelectronics A*STAR
Binni Varghese — Institute of Microelectronics A*STAR
Nandini Venkataraman — Institute of Microelectronics A*STAR
Vempati Srinivasa Rao — Institute of Microelectronics A*STAR
Navab Singh — Institute of Microelectronics A*STAR

19. Fundamental Study on Reflow Mechanisms of Sn and Sn Alloys for Fine Bump Pitch Scaling
Chongyang Cai — Intel Corporation
Anup Panindre — Intel Corporation
Liang He — Intel Corporation
Jung Kyu Han — Intel Corporation
Gang Duan — Intel Corporation
Rahul Manepalli — Intel Corporation

22. 20 µm Pitch Cu-to-Cu Flip-Chip Interconnects Through Cu Nanoparticles Sintering
Xinrui Ji — Delft University of Technology
Leiming Du — Delft University of Technology
Henk van Zeijl — Delft University of Technology
Guoqi Zhang — Delft University of Technology
Jaber Derakhshandeh — imec
Eric Beyne — imec

24. Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure
Chien Kang Hsiung — Applied Materials, Inc.
Terry Wang — Industrial Technology Research Institute
Sarah Wozny — Applied Materials, Inc.
Marvvin L Bernt — Applied Materials, Inc.
Kuan-Nang Chen — National Yang Ming Chiao Tung University

25. A Warpage Investigation for a Large Panel-Sized Interposer With Embedded Dies
Katsuaki To — Resonac Corporation
Daisuke Yamanaka — Resonac Corporation
Masashi Minami — Resonac Corporation
Shan Ho Tsai — Resonac Corporation
Sadaaki Katoh — Resonac Corporation

26. Development of Two Different Molding Methods in 2.5D Package With 20 μm or Less Fine Bump Pitch CoW Structure
Takeshi Saito — Resonac Corporation
Sadaaki Katoh — Resonac Corporation
Keiko Ueno — Resonac Corporation
Ryosuke Kimura — Resonac Corporation
Tsai Shanho — Resonac Corporation
Takahiro Iseki — Resonac Corporation
Kan Donchoru — Resonac Corporation

27. Low Temperature Cu/SiO2 Hybrid Bonding With Protruding Copper Pads
Junpeng Fang — Tsinghua University
Qian Wang — Tsinghua University
Jiexun Yu — Tsinghua University
Ziqing Wang — Tsinghua University
Yikang Zhou — Semiconductor Technology Innovation Center (Beijing) Corporation
Kai Zheng — Semiconductor Technology Innovation Center (Beijing) Corporation
Jian Cai — Tsinghua University

28. Analysis of Vacancies in Wafer-Bonding Interface Via Positron Annihilation Lifetime Spectroscopy
Sotetsu Saito — Sony Semiconductor Solutions Corporation
Nobutoshi Fujii — Sony Semiconductor Solutions Corporation
Shunsuke Furuse — Sony Semiconductor Solutions Corporation
Naoki Ogawa — Sony Semiconductor Solutions Corporation
Suguru Saito — Sony Semiconductor Solutions Corporation
Yoshiya Hagimoto — Sony Semiconductor Solutions Corporation
Hayato Iwamoto — Sony Semiconductor Solutions Corporation

29. Annealing Effects in Sub-8 μm Pitch Die-to-Wafer Hybrid Bonding
Partha Mukhopadhyay — TEL Technology Center, America, LLC
Laura Wenzel — Fraunhofer IZM
Catharina Rudolph — Fraunhofer IZM
Andrew Tuchman — TEL Technology Center, America, LLC
Kevin Ryan — TEL Technology Center, America, LLC
Adam Gildea — TEL Technology Center, America, LLC
Chuck Woychik — SkyWater Technology
Chris Nichols — SkyWater Technology
John Allgair — BRIDG
Sitaram Arkalgud — TEL Technology Center, America, LLC
Anton deVilliers — TEL Technology Center, America, LLC
Jim Fulford — TEL Technology Center, America, LLC

31. Through Dielectric Via Etching in Magnetic Neutral Loop Discharge Plasma for 3D Chiplets Interconnect
Yasuhiro Morikawa — ULVAC, Inc.

32. A Novel Plasma Etching Technology of RIE-Lag Free TSV and Dicing Processes for 3D Chiplets Interconnect
Taichi Suzuki — ULVAC, Inc.
Kenta Doi — ULVAC, Inc.
Yasuhiro Morikawa — ULVAC, Inc.

33. Aluminum to Copper Thermal Compression Bonding for Heterogeneous Integration of Legacy Dielets
Krutikesh Sahoo — University of California, Los Angeles
Randall Irwin — University of California, Los Angeles
Golam Sabbir — University of California, Los Angeles
Vineeth Harish — University of California, Los Angeles
Subramanian Iyer — University of California, Los Angeles

34. Directional Atmospheric Plasma De-oxidation for Ultra Small Passive Component Assembly
Khouloud Ben Harzallah — University of Sherbrooke
David Danovitch — University of Sherbrooke
Malak Kanso — University of Sherbrooke
Christian Bergeron — IBM Canada, Ltd.
Marc-Olivier Pion — IBM Canada, Ltd.

35. Exploring Bonding Mechanisms of SiCN for Hybrid Bonding
Sodai Ebiko — Yokohama National University
Serena Iacovo — imec
Soon-Aik Chew — imec
Boyao Zhang — imec
Akira Uedono — University of Tsukuba
Fumihiro Inoue — Yokohama National University