Technical Program

Program Sessions: Friday May 31st 9:30 AM – 12:35 PM

Session 30: Process and Hybrid Bonding Modeling and Characterization
Committee: Thermal/Mechanical Simulation & Characterization
Room: Summit 4-5

Session Co-Chairs:

Pradeep Lall
Auburn University
Email: [email protected]

Xuejun Fan
Lamar University
Email: [email protected]


1. Modeling of Copper Hybrid Bonding Anneal
Joshua Hooge — Tokyo Electron, Ltd.
Chris Netzband — Tokyo Electron, Ltd.

2. Investigating Sintering Mechanism of 100 nm Ag Nanoparticles via In-Situ SEM Observation and Phase Field Simulation
Xiao Hu — Delft University of Technology
Dong Hu — Delft University of Technology
René Poelma — Nexperia
Jianlin Huang — Ampleon B.V.
Willem Van Driel — Delft University of Technology
Guoqi Zhang — Delft University of Technology

3. Elucidating the Mechanism of Four Corner Voids in Chip-on-Wafer Hybrid Bonding
Takaaki Hirano — Sony Semiconductor Solutions Corporation
Tatsumasa Hiratsuka — Sony Semiconductor Solutions Corporation
Hirotaka Yoshioka — Sony Semiconductor Solutions Corporation
Naoki Ogawa — Sony Semiconductor Solutions Corporation
Suguru Saito — Sony Semiconductor Solutions Corporation
Shoji Kobayashi — Sony Semiconductor Solutions Corporation
Yoshiya Hagimoto — Sony Semiconductor Solutions Corporation
Hayato Iwamoto — Sony Semiconductor Solutions Corporation

4. Fan-Out Embedded Bridge Structure for Co-Packaged Optics Characterization and Evaluation
Vito Lin — Siliconware Precision Industries Co., Ltd.
Teny Shih — Siliconware Precision Industries Co., Ltd.
Andrew Kang — Siliconware Precision Industries Co., Ltd.
Yu-Po Wang — Siliconware Precision Industries Co., Ltd.

5. Advanced Atomic-Scale Insights Into the Chemical Mechanical Polishing Process With Ceria Abrasives Using Molecular Dynamics and Neural Network Potential
Yoshishige Okuno — Resonac Corporation
Teruo Hirakawa — Resonac Corporation
Fukiko Ota — Resonac Corporation
Hiromu Kubo — Resonac Corporation
Yuuto Kurata — Resonac Corporation
Akihiro Orita — Resonac Corporation
Satoyuki Nomura — Resonac Corporation

6. Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction
Kyungmin Baek — Samsung Electronics Co., Ltd.
Min-soo Han — Samsung Electronics Co., Ltd.
Il Young Han — Samsung Electronics Co., Ltd.
Jung Shin Lee — Samsung Electronics Co., Ltd.
Jaeuk Sim — Samsung Electronics Co., Ltd.
Joongha Lee — Samsung Electronics Co., Ltd.
Daeho Min — Samsung Electronics Co., Ltd.
Kyeongbin Lim — Samsung Electronics Co., Ltd.
Minwoo Daniel Rhee — Samsung

7. Measurement of the Interfacial Strength of Thin Metal Film by Laser Spallation Method for Advanced Wafer Level Package
Young-Min Ju — Hanyang University
Jin-Young Kim — Hanyang University
Hui-Jin Um — Hanyang University
Se-Min Lee — Hanyang University
Dukyong Kim — Hanyang University
Woong-Kyoo Yoo — Hanyang University
Daewoong Lee — SK Hynix, Inc.
Yeontaek Hwang — SK Hynix, Inc.
Seung Hwan Lee — Hanyang University
Hak-Sung Kim — Hanyang University