Technical Program

Program Sessions: Friday May 31st 9:30 AM – 12:35 PM

Session 27: Advanced Die Bond and Board Level Reliability
Committees: Materials & Processing and Assembly & Manufacturing Technology
Room: Crest 3-5

Session Co-Chairs:

Jason Rouse
Taiyo America
Email: [email protected]

Omkar Gupte
Email: [email protected]


1. Impact of Chip-Package Parameters on the Thermomechanical Reliability of High Thermal Die Attach Materials in RF, Power, and Automotive Applications
A R Nazmus Sakib — Renesas Electronics America
Ruther Ricon — Renesas Electronics America
Jake Eom — Renesas Electronics Corporation
Yoshitsugu Kawashima — Renesas Electronics Corporation
Kosuke Azuma — Renesas Electronics Corporation
Ganesh Tharumalingam — Renesas Electronics Corporation
Young Kim — Renesas Electronics Corporation

2. The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications
Hongwen Zhang — Indium Corporation
Kyle Aserian — Indium Corporation
David Hu — Indium Corporation
Bo Chen — Alpha and Omega Semiconductor Ltd.
Tyler Richmond — Indium Corporation
Leo Hu — Indium Corporation
Kaiyuan Zhu — Alpha and Omega Semiconductor Ltd.
Mary Jane R. Alin — Alpha and Omega Semiconductor Ltd.

3. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
Xu Liu — Delft University of Technology
Shaogang Wang — Delft University of Technology
Dong Hu — Delft University of Technology
Chenshan Gao — Southern University of Science and Technology
Qianming Huang — Southern University of Science and Technology
Huaiyu Ye — Southern University of Science and Technology
Paddy French — Delft University of Technology
Guoqi Zhang — Delft University of Technology

4. Complex Board Via Structure Induced Uneven Stress/Strain Impact on Interconnect Stability: SAC305, Full and Hybrid LTS Comparison
Tae-Kyu Lee — Cisco Systems, Inc.
Yujin Park — Cisco Systems, Inc.
Gnyaneshwar Ramakrishna — Cisco Systems, Inc.
Jonghyun Nam — SK Hynix, Inc.
Daljin Yoon — SK Hynix, Inc.
Heera Roh — SK Hynix, Inc.

5. Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution
Lip Teng Saw — Western Digital Corporation
Mutharasu Devarajan — Western Digital Corporation
Puurnaraj A/L Nadarajah — Western Digital
Chye Yang Soo — Western Digital

6. Enabling Socketable BGAs With Eutectic-Forming Bi-Based Coatings on Sn Spheres: a Closer Look at the Bi Deposition Process
Jaewon Lee — Georgia Institute of Technology
Vanessa Smet — Georgia Institute of Technology

7. Develop New Solder Alloy for High Reliability Device
Albert T. Wu — National Central University
Watson Tseng — Shenmao Technology, Inc.
Chang-Meng Wang — Shenmao Technology, Inc.
Wei Ting Lin — National Central University