Technical Program

Program Sessions: Thursday May 30th 2:00 PM – 5:05 PM

Session 23: Novel Bonding Technology for Advanced Assembly Substrates and Integration
Committee: Assembly & Manufacturing Technology
Room: Summit 6-7

Session Co-Chairs:

Valerie Oberson
IBM
Email: [email protected]

Pascale Gagnon
IBM
Email: [email protected]

Papers:

1. Advanced Thermocompression Bonding on High Density Fan-Out Embedded Bridge Technology for HPC/AI/ML Applications
Wiwy Wudjud — Advanced Semiconductor Engineering, Inc. (US)
ShuYu Lin — Advanced Semiconductor Engineering, Inc.
Yungshun Chang — Advanced Semiconductor Engineering, Inc.
Jean Yen — Advanced Semiconductor Engineering, Inc.
Reno Liao — Advanced Semiconductor Engineering, Inc.
Leo H.S. Cheng — Advanced Semiconductor Engineering, Inc.
YiHsien Wu — Advanced Semiconductor Engineering, Inc.
Simon Y.L. Huang — Advanced Semiconductor Engineering, Inc.
Ivan R.C. Chen — Advanced Semiconductor Engineering, Inc.
ChengYu Lee — Advanced Semiconductor Engineering, Inc.
Joey C.I. Huang — Advanced Semiconductor Engineering, Inc.
Lihong Cao — Advanced Semiconductor Engineering, Inc. (US)

2. Various Defect Mechanism Analysis for Optimization of Vacuum Fluxless Solder Reflow Performance Using 10 µm or Below Microbumps
Lei Jing — Yield Engineering Systems
Alvin Lin — Yield Engineering Systems
Xinxuan Tan — Yield Engineering Systems
Anderson Chen — Yield Engineering Systems
Vladimir Kudriavtsev — Yield Engineering Systems
Lucky Murugesh — Yield Engineering Systems
Zia Karim — Yield Engineering Systems

3. Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding With Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch
Kwang-Seong Choi — Electronics and Telecommunications Research Institute
Jiho Joo — Electronics and Telecommunications Research Institute
Gwang-Mun Choi — Electronics and Telecommunications Research Institute
Jungho Shin — Electronics and Telecommunications Research Institute
Chanmi Lee — Electronics and Telecommunications Research Institute
Ki-Seok Jang — Electronics and Telecommunications Research Institute
Jin-Hyuk Oh — Electronics and Telecommunications Research Institute
Ho-Gyeong Yun — Electronics and Telecommunications Research Institute
Seok Hwan Moon — Electronics and Telecommunications Research Institute
Ji Eun Jung — Electronics and Telecommunications Research Institute
Gaeun Lee — Electronics and Telecommunications Research Institute
Yong-Sung Eom — Electronics and Telecommunications Research Institute

4. Novel Molded FCBGA Package Platform for Highly Reliable Automotive Applications
Inrack Kim — Amkor Technology Korea
Nari Kim — Amkor Technology Korea
Gayoung Shin — Amkor Technology Korea
Youngdo Kweon — Amkor Technology, Inc.

5. Study of Fabrication and Reliability for 120 mm x 120 mm Extremely Large Advanced 2.5D Package
Kazue Hirano — Resonac Corporation
Dongchul Kang — Resonac Corporation
Sadaaki Katoh — Resonac Corporation
Masaki Takahashi — Resonac Corporation
Takahiro Iseki — Resonac Corporation
Kosuke Murai — Resonac Corporation

6. Thin Substrate Bonding
Partia Naghibi — HRL Laboratories, LLC

7. High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry
Bongsub Lee — Adeia
Oliver Zhao — Adeia
Arianna Avellán — Adeia
Suhail Sadiq — Adeia
Gill Fountain — Adeia
Dominik Suwito — Adeia
Guilian Gao — Adeia
Laura Mirkarimi — Adeia