Technical Program

Program Sessions: Thursday May 30th 2:00 PM – 5:05 PM

Session 22: Signal & Power Integrity for Advanced Packages and Systems
Committee: RF, High-Speed Components & Systems
Room:

Session Co-Chairs:

Hideki Sasaki
Rapidus
Email: [email protected]

Srikrishna Sitaraman
Marvel
Email: [email protected]

Papers:

1. High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology
Chih-Hsin Lu — Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chia Lin — Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Chun Tang — Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Yi Lin — Taiwan Semiconductor Manufacturing Company, Ltd.
Jay Chang — Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Hao Tsai — Taiwan Semiconductor Manufacturing Company, Ltd.
Harry Hsia — Taiwan Semiconductor Manufacturing Company, Ltd.
J.C. Twu — Taiwan Semiconductor Manufacturing Company, Ltd.
C.S. Liu — Taiwan Semiconductor Manufacturing Company, Ltd.
Gene Wu — Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Chung Yee — Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas Yu — Taiwan Semiconductor Manufacturing Company, Ltd.

2. High Frequency Validation of Djordjevic-Sarkar Model for Low Loss Package Dielectrics
Cemil Geyik — Intel Corporation
Michael Hill — Intel Corporation
Zhichao Zhang — Intel Corporation
Kemal Aygun — Intel Corporation

3. System Level Analysis and Design Optimization of Back-Side Power Delivery Network for Advanced Nodes
Kyunghwan Song — Samsung
Sungwook Moon — Samsung
Minseok Kang — Samsung
Yongho Lee — Samsung
Duhyoung Ahn — Samsung
Hyeonjin Kim — Samsung

4. PDN Impedance Optimization of AR/VR Systems: A Trade-Off in VRM Bandwidth and Board Decouplings
Wendem Beyene — Meta Platforms, Inc.
Ling Jiang — Meta Platforms, Inc.
Koichi Yamaguchi — Meta Platforms, Inc.
Xiaoping Liu — Meta Platforms, Inc.
Ashkan Hashemi — Meta Platforms, Inc.

5. Physical-Based Package Verification Methodology for High-Speed Channel Crosstalk and Correlation With BER Measurements
Po-Wei Chiu — Advanced Micro Devices, Inc.
Chao-Chin Lee — Advanced Micro Devices, Inc.
Guan-Yu Lin — Advanced Micro Devices, Inc.
Jinsung Youn — Advanced Micro Devices, Inc.
Youngsoo Lee — Advanced Micro Devices, Inc.
Hong Shi — Advanced Micro Devices, Inc.
Alan Fang — Advanced Micro Devices, Inc.
Santiago Asuncion — Advanced Micro Devices, Inc.

6. An Energy Efficient DDR5 I/O Performance Boost in Clamshell Configuration by Charge Pumping From Non-Target Device
Ryuichi Oikawa — Renesas Electronics Corporation

7. Signal Integrity Analysis and Design Optimization Using Neural Networks
Juhitha Konduru — University of Illinois
Oleg Mikulchenko — Intel Corporation
Loke Yip Foo — Intel Corporation
José Schutt-Ainé — University of Illinois