Technical Program

Program Sessions: Thursday May 30th 9:30 AM – 12:35 PM

Session 16: Reliability of High-Density and High-Power Packages
Committee: Applied Reliability
Room:

Session Co-Chairs:

Scott Savage
Medtronic Microelectronics
Email: [email protected]

Nokibul Islam
JCET Group
Email: [email protected]

Papers:

1. Structural Characterization of 2.5D System in Package Combined With High Bandwidth Memory for Enhanced Quality and Reliability
Byoungdo Lee — SK Hynix, Inc.
Jinwoo Choi — SK Hynix, Inc.
Sangyong Lee — SK Hynix, Inc.
Jinwoo Park — SK Hynix, Inc.
Gyujei Lee — SK Hynix, Inc.
Kangwook Lee — SK Hynix, Inc.

2. Reliability Investigations of Advanced Photosensitive Polymer Based RDL Processes Protected by Inorganic Capping Layers
Emmanuel Chery — imec
Ritwik Bhatia — Veeco
Ganesh Sundaram — Veeco
Nelson Pinho — imec
Eric Beyne — imec

3. Indium Thermal Interface Material (TIM) Degradation: Bake Experiments, Models, and Reliability Implications
Amir Behnam — Advanced Micro Devices, Inc.
Chris Dmuchowski — Advanced Micro Devices, Inc.
Kaushik Mysore — Advanced Micro Devices, Inc.

4. Methods for Non-Destructive Failure Analysis of Hybrid Bonded Components
Matthew Bahr — Sandia National Laboratories
Jeremy Walraven — Sandia National Laboratories
William Mook — Sandia National Laboratories
Amun Jarzembski — Sandia National Laboratories
Wyatt Hodges — Sandia National Laboratories
William Delmas — Sandia National Laboratories
Zachary Piontkowski — Sandia National Laboratories
Matthew Jordan — Sandia National Laboratories

5. Electromigration Failure Mechanisms of Cu-Cu Joints at Low Stressing Temperatures
Shih-Chi Yang — Department of Materials and Science Engineering
Chih Chen — National Yang Ming Chiao Tung University

6. A Data-Driven Machine Learning Model to for the Stress-Strain Behavior of Single Grain SAC305 Solder Joints
Debabrata Mondal — Auburn University
Jeffrey Suhling — Auburn University
Elham Mirkoohi — Auburn University
Pradeep Lall — Auburn University

7. BGA Electromigration Performance and Why it Has Become the Bottleneck
Riet Labie — imec
Wolfgang Sauter — Marvell Technology, Inc.
Eric Tremble — Marvell Technology, Inc.
Richard Graf — Marvell Technology, Inc.
Chinmay Nawghane — imec
Dimitrios Tsiakos — imec
Jan Mertens — imec